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HINGED FRAME HMC 6B F. 2 MODULES
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Quantity:
BC68PAS115
NXP USA Inc.
LI0201C121R-10
Laird-Signal Integrity Products
SPMWH1228MD5WAVMVL
Samsung Semiconductor, Inc.
BK/GMD-800MA
Eaton - Electronics Division
24VL025/MS
Microchip Technology
