TE Application Tooling 4-1633569-4

CRIMPER, INSULATION OVERLAP (.08

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LAPP

NLAS4501DFT2

onsemi

DSPIC33CH64MP206-E/MR

Microchip Technology

R1224N102M-TR-FE

Nisshinbo Micro Devices Inc.

SI5330G-B00219-GM

Skyworks Solutions Inc.