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SOLDER 500G JAR,SN96.5 AG3.0
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Quantity:
MPXV5010GC6U
NXP USA Inc.
MFR50SFTE52-562K
YAGEO
ORNTA5000FT1
Vishay Dale Thin Film
CNA5L1X7R1H475K160AE
TDK Corporation
A17712-10
Laird Technologies - Thermal Materials
