CUI Devices HSB09-212115

HEAT SINK, BGA, 21 X 21 X 15 MM

In Stock : Please Inquiry

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SLF10145T-102MR29-H

TDK Corporation

1808Y1000561KFT

Knowles Syfer

QVMQF326P33-2.0A-16.384

Mercury United Electronics, Inc.

VI-254-EW-F2

Vicor Corporation

FCQ38999/26ZD4ANMIL-STD-461

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