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550-10-352M26-001166

Preci-Dip

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Preci-Dip

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BGA PIN ADAPTER 1.27MM SMD

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Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Contact Material - Post	Brass
Housing Material	FR4 Epoxy Glass
Current Rating (Amps)	1 A
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Active
Number of Positions or Pins (Grid)	352 (26 x 26)
Contact Finish Thickness - Post	10.0µin (0.25µm)
Pitch - Post	0.050" (1.27mm)
Series	550
Type	BGA
Contact Finish - Post	Gold
Mfr	Preci-Dip
Features	Closed Frame
Termination Post Length	0.098" (2.50mm)
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.050" (1.27mm)
Package	Bulk
Contact Resistance	10mOhm
Base Product Number	550-10