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BDN09-3CB

CTS Thermal Management Products

Product No:

BDN09-3CB

Package:

-

Batch:

-

Datasheet:

-

Description:

HEATSINK CPU .91" SQ

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : 990

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $1.311

    $1.311

  • 10

    $1.2483

    $12.483

  • 25

    $1.21562

    $30.3905

  • 50

    $1.18275

    $59.1375

  • 100

    $1.11701

    $111.701

  • 250

    $1.051308

    $262.827

  • 500

    $0.985606

    $492.803

  • 1000

    $0.919904

    $919.904

  • 5000

    $0.887053

    $4435.265

Not the price you want? Send RFQ Now and we'll contact you ASAP.

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IICSEMI, as a globally renowned distributor of electronic components,sells a wide range of electronic parts from the world's top brands, ensuring all products undergo strict quality control and meet the highest standards. If you are interested in learning about the detailed specifications,configurations, pricing, lead times, and payment terms for BDN09-3CB, please feel free to contact us. To facilitate the processing of your inquiry, kindly include BDN09-3CB and the required quantity in your RFQ. IICSEMI provides the latest quote for BDN09-3CB without requiring registration. Latest information on BDN09-3CB: #Specifications #FAQ #Datasheet #Labels #Related Products #Associated Blogs BDN09-3CB latest information:#Specification#FAQ#Datasheet#Tags#Recommended Parts#Related Blog

Product Information

Parameter Info

User Guide

Shape Square, Pin Fins
Material Aluminum
Product Status Active
Fin Height 0.355" (9.02mm)
Series BDN
Type Top Mount
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 400 LFM
Length 0.910" (23.11mm)
Thermal Resistance @ Natural 26.90°C/W
Mfr CTS Thermal Management Products
Package Box
Material Finish Black Anodized
Attachment Method Thermal Tape, Adhesive (Not Included)
Width 0.910" (23.11mm)
Power Dissipation @ Temperature Rise -
Diameter -
Base Product Number BDN09
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)

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