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ESQT-130-02-L-6-700-029

Samtec Inc.

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Samtec Inc.

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CONN SOCKET 180P 0.079 GOLD PCB

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Product Information

Parameter Info

User Guide

Insulation Height	0.700" (17.78mm)
Ingress Protection	-
Voltage Rating	-
Current Rating (Amps)	4.5A per Contact
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Type	Forked
Material Flammability Rating	UL94 V-0
Product Status	Active
Connector Type	Elevated Socket
Mfr	Samtec Inc.
Contact Material	Phosphor Bronze
Style	Board to Board or Cable
Features	-
Pitch - Mating	0.079" (2.00mm)
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	6
Applications	-
Number of Positions	180
Termination	Solder
Mounting Type	Through Hole
Fastening Type	Push-Pull
Insulation Material	Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Post	-
Series	ESQT
Contact Shape	Square
Row Spacing - Mating	0.079" (2.00mm)
Insulation Color	Black
Contact Finish - Post	Tin
Number of Positions Loaded	179
Contact Length - Post	0.150" (3.81mm)
Mated Stacking Heights	-
Package	Bulk
Base Product Number	ESQT-130