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ESQT-136-02-M-T-692-108

Samtec Inc.

Product No:

ESQT-136-02-M-T-692-108

Manufacturer:

Samtec Inc.

Package:

-

Batch:

-

Datasheet:

-

Description:

CONN SOCKET 108P 0.079 GOLD PCB

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Insulation Height 0.692" (17.58mm)
Ingress Protection -
Voltage Rating -
Current Rating (Amps) 4.5A per Contact
Contact Finish Thickness - Mating 20.0µin (0.51µm)
Contact Type Forked
Material Flammability Rating UL94 V-0
Product Status Active
Connector Type Elevated Socket
Mfr Samtec Inc.
Contact Material Phosphor Bronze
Style Board to Board or Cable
Features -
Pitch - Mating 0.079" (2.00mm)
Contact Finish - Mating Gold
Operating Temperature -55°C ~ 125°C
Number of Rows 3
Applications -
Number of Positions 108
Termination Solder
Mounting Type Through Hole
Fastening Type Push-Pull
Insulation Material Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Post -
Series ESQT
Contact Shape Square
Row Spacing - Mating 0.079" (2.00mm)
Insulation Color Black
Contact Finish - Post Tin
Number of Positions Loaded 107
Contact Length - Post 0.158" (4.01mm)
Mated Stacking Heights -
Package Bulk
Base Product Number ESQT-136

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