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APF6-060-03.5-S-04-2-TR

Samtec Inc.

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Samtec Inc.

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0.635 MM PITCH ACCELERATE HP HIG

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User Guide

Number of Rows	4
Number of Positions	240
Contact Finish Thickness	30.0µin (0.76µm)
Contact Finish	Gold
Height Above Board	0.144" (3.66mm)
Mounting Type	Surface Mount
Product Status	Active
Series	AcceleRate®HD APF6
Connector Type	High Density Array, Female
Pitch	0.025" (0.64mm)
Mfr	Samtec Inc.
Features	-
Package	Bulk
Mated Stacking Heights	5mm, 10mm

Detail Info

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