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ESW-131-59-G-S-LL

Samtec Inc.

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ESW-131-59-G-S-LL

Manufacturer:

Samtec Inc.

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Description:

CONN SOCKET 31POS 0.1 GOLD PCB

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User Guide

Insulation Height	0.635" (16.13mm)
Ingress Protection	-
Voltage Rating	550VAC
Current Rating (Amps)	5.2A per Contact
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Type	Forked
Material Flammability Rating	UL94 V-0
Product Status	Active
Connector Type	Elevated Socket
Mfr	Samtec Inc.
Contact Material	Phosphor Bronze
Style	Board to Board
Features	-
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	1
Applications	-
Number of Positions	31
Termination	Kinked Pin, Solder
Mounting Type	Through Hole
Fastening Type	Push-Pull
Insulation Material	Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Post	3.00µin (0.076µm)
Series	ESW
Contact Shape	Square
Row Spacing - Mating	-
Insulation Color	Black
Contact Finish - Post	Gold
Number of Positions Loaded	All
Contact Length - Post	0.280" (7.11mm)
Mated Stacking Heights	-
Package	Bulk
Base Product Number	ESW-131

Detail Info

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