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IW-HSKALU-CLASLR-CU03

iWave Systems

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iWave Systems

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ZU+ MPSOC SOM MODULE HEATSINK

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User Guide

Shape	Rectangular, Fins
Material	Aluminum
Product Status	Active
Fin Height	1.181" (30.00mm)
Series	-
Type	Top Mount
Thermal Resistance @ Forced Air Flow	-
Length	3.740" (95.00mm)
Thermal Resistance @ Natural	-
Mfr	iWave Systems
Package	Bulk
Material Finish	-
Attachment Method	Bolt On
Width	2.953" (75.00mm)
Power Dissipation @ Temperature Rise	-
Diameter	-
Package Cooled	FPGA

Detail Info

GOOD作为全球著名的电子元器件产品分销商，销售来自世界顶级品牌商的多种电子元件，确保所有产品均经过严格质量控制，符合最高标准。如有兴趣了解 IW-HSKALU-CLASLR-CU03 的详细规格、配置、价格、供货周期及付款条款，请随时联系我们。为便于处理您的询价，请将 IW-HSKALU-CLASLR-CU03 及其所需数量列入RFQ。 GOOD无需注册即可获取 IW-HSKALU-CLASLR-CU03 的最新报价。 IW-HSKALU-CLASLR-CU03 最新信息：#规格#FAQ#数据手册#相关产品#关联博客

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