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MMIC271609T4064C0300

TDK InvenSense

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TDK InvenSense

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MICROPHONE MEMS ANALOG -38DB

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User Guide

Shape	Rectangular
S/N Ratio	61.5dB
Output Type	Analog
Termination	Solder Pads
Size / Dimension	0.108" L x 0.073" W (2.75mm x 1.85mm)
Current - Supply	90 µA
Direction	-
Height (Max)	0.039" (1.00mm)
Product Status	Obsolete
Ratings	-
Series	MMIC
Type	MEMS (Silicon)
Sensitivity	-38dB ±3dB @ 94dB SPL
Mfr	TDK InvenSense
Port Location	Bottom
Package	Bulk
Impedance	400 Ohms

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