Chip Quik Inc.
Product No:
NC191SNL35
Manufacturer:
Package:
-
Batch:
-
Description:
SMOOTH FLOW LEAD-FREE SOLDER PAS
Quantity:
Delivery:
Payment:
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Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
Form | Syringe, 1.23 oz (35g), 10cc |
Process | Lead Free |
Product Status | Active |
Wire Gauge | - |
Flux Type | No-Clean |
Series | Smooth Flow™ |
Type | Solder Paste |
Shelf Life Start | Date of Manufacture |
Mesh Type | 4 |
Mfr | Chip Quik Inc. |
Package | Bulk |
Shelf Life | 6 Months |
Melting Point | 422 ~ 428°F (217 ~ 220°C) |
Diameter | - |
Base Product Number | NC191 |