Renesas Electronics America Inc
Product No:
R9A06G037GNP#AA0
Manufacturer:
Package:
64-HVQFN (9x9)
Batch:
-
Datasheet:
-
Description:
SOC PLC MODEM LSI SMART GRID ASS
Quantity:
Delivery:
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Core Processor | ARM® Cortex®-M3 |
Operating Temperature | -40°C ~ 85°C (TA) |
Speed | 138MHz |
Architecture | DSP, MCU |
Flash Size | - |
RAM Size | 128KB |
Number of I/O | 16 |
Peripherals | PWM |
Product Status | Active |
Supplier Device Package | 64-HVQFN (9x9) |
Series | - |
Package / Case | 64-VFQFN Exposed Pad |
Mfr | Renesas Electronics America Inc |
Connectivity | CSI, I²C, UART |
Package | Tray |
Primary Attributes | - |