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XC4062XL-3BG560C

AMD

Product No:

XC4062XL-3BG560C

Manufacturer:

AMD

Package:

560-LBGA Exposed Pad, Metal

Batch:

-

Datasheet:

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Description:

IC FPGA 384 I/O 560MBGA

Quantity:

Delivery:

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Product Information

Parameter Info

User Guide

Operating Temperature 0°C ~ 85°C (TJ)
Category Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)
Total RAM Bits 73728
Number of LABs/CLBs 2304
Number of I/O 384
Mounting Type Surface Mount
Supplier Device Package 560-MBGA (42.5x42.5)
Series XC4000E/X
Package / Case 560-LBGA Exposed Pad, Metal
Voltage - Supply 3V ~ 3.6V
Number of Gates 62000
Part Status Obsolete
Mfr Xilinx Inc.
Package Tray
Number of Logic Elements/Cells 5472
Base Product Number XC4062XL

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