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XR2C-2000-HSG

Omron Electronics Inc-EMC Div

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XR2C-2000-HSG

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Omron Electronics Inc-EMC Div

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Description:

CONN IC SOCKET 20POS

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Contact Finish - Mating	-
Operating Temperature	-55°C ~ 125°C
Contact Material - Post	Beryllium Copper
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Current Rating (Amps)	1 A
Contact Finish Thickness - Mating	-
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	-
Product Status	Obsolete
Number of Positions or Pins (Grid)	20 (1 x 20)
Contact Finish Thickness - Post	-
Pitch - Post	0.100" (2.54mm)
Series	XR2
Type	Housing
Contact Finish - Post	-
Mfr	Omron Electronics Inc-EMC Div
Features	Closed Frame
Termination Post Length	-
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.100" (2.54mm)
Package	Bulk
Contact Resistance	20mOhm