ACA-SPI-006-K01
LOTES
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产品信息
参数信息
用户指南
| Contact Finish - Mating | Gold |
| Operating Temperature | - |
| Contact Material - Post | Phosphor Bronze |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Contact Finish Thickness - Mating | 1.00µin (0.025µm) |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Product Status | Active |
| Number of Positions or Pins (Grid) | 16 (2 x 8) |
| Contact Finish Thickness - Post | 1.00µin (0.025µm) |
| Pitch - Post | 0.050" (1.27mm) |
| Series | - |
| Type | SOIC |
| Contact Finish - Post | Gold |
| Mfr | LOTES |
| Features | Board Guide, Closed Frame |
| Termination Post Length | - |
| Contact Material - Mating | Phosphor Bronze |
| Pitch - Mating | 0.050" (1.27mm) |
| Package | Tape & Reel (TR) |
| Contact Resistance | 30mOhm |
ACA-SPI-006-K01 标签
2000+日均询价数量
30,000,000标准产品数量
2800+全球品牌
15,000 ㎡库存仓库
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