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FI-XB30SSLA-HF15

JAE Electronics

型号:

FI-XB30SSLA-HF15

封装:

-

批次:

-

数据手册:

pdf.png

描述:

CONN RCPT 30P 0.039 GOLD SMD R/A

购买数量:

递送:

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付款:

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库存 : 1441

最小起订量: 1 最小递增量: 1

数量

单价

总价

  • 1

    $16.8435

    $16.8435

  • 10

    $14.59865

    $145.9865

  • 100

    $12.03213

    $1203.213

  • 500

    $10.989353

    $5494.6765

请发送询价,我们将立即回复。

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产品信息

参数信息

用户指南

Insulation Height -
Ingress Protection -
Voltage Rating 200V
Current Rating (Amps) 1A per Contact
Contact Finish Thickness - Mating 3.90µin (0.099µm)
Contact Type Non-Gendered
Material Flammability Rating UL94 V-0
Product Status Active
Connector Type Receptacle
Mfr JAE Electronics
Contact Material Copper Alloy
Style Board to Cable/Wire
Features Grounding Pins, Shielded, Solder Retention
Pitch - Mating 0.039" (1.00mm)
Contact Finish - Mating Gold
Operating Temperature -40°C ~ 80°C
Number of Rows 1
Applications General Purpose
Number of Positions 30
Termination Solder
Mounting Type Board Cutout, Bottom Mount, Surface Mount, Right Angle
Fastening Type Friction Lock
Insulation Material Plastic
Contact Finish Thickness - Post -
Series FI-X
Contact Shape -
Row Spacing - Mating -
Insulation Color Beige
Contact Finish - Post Tin
Number of Positions Loaded All
Contact Length - Post -
Mated Stacking Heights -
Package Tape & Reel (TR)
Base Product Number FI-XB30

FI-XB30SSLA-HF15 标签

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