Chip Quik Inc.
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Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Storage/Refrigeration Temperature | - |
Form | Jar |
Digi-Key Storage | - |
Process | Lead Free |
Product Status | Active |
Wire Gauge | - |
Flux Type | - |
Series | SMD2 |
Type | Solder Sphere |
Shelf Life Start | Date of Manufacture |
Mfr | Chip Quik Inc. |
Package | Bulk |
Shelf Life | 24 Months |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Diameter | 0.024" (0.61mm) |