XG4H-2631
Omron Electronics Inc-EMC Div
型号:
XG4H-2631
封装:
-
批次:
-
数据手册:
描述:
CONN RCPT 26POS 0.1 GOLD PCB
购买数量:
递送:
付款:
库存 : 请查询
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产品信息
参数信息
用户指南
| Insulation Height | 0.283" (7.19mm) |
| Ingress Protection | - |
| Voltage Rating | 300VAC |
| Current Rating (Amps) | 3A |
| Contact Finish Thickness - Mating | 5.90µin (0.150µm) |
| Contact Type | Female Socket |
| Material Flammability Rating | UL94 V-0 |
| Product Status | Active |
| Connector Type | Receptacle |
| Mfr | Omron Electronics Inc-EMC Div |
| Contact Material | Phosphor Bronze |
| Style | Board to Board |
| Features | Polarizing Key |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Operating Temperature | -55°C ~ 105°C |
| Number of Rows | 2 |
| Applications | - |
| Number of Positions | 26 |
| Termination | Solder |
| Mounting Type | Through Hole |
| Fastening Type | Latch Holder |
| Insulation Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Contact Finish Thickness - Post | 78.7µin (2.00µm) |
| Series | XG4 |
| Contact Shape | Square |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Insulation Color | Black |
| Contact Finish - Post | Tin |
| Number of Positions Loaded | All |
| Contact Length - Post | 0.122" (3.10mm) |
| Mated Stacking Heights | 9.7mm, 10.1mm |
| Package | Bulk |
| Base Product Number | XG4H |
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