In 2025, the electronic components sector presents a distinct "diverging trend." On one side, demand in AI and new energy fields is soaring, while on the other, traditional consumer electronics face overcapacity, making supply-demand imbalance the most prominent industry pain point. The CSI Electronic Components Index rose slightly by 2.3% in early December, but there were significant differences among sub-sectors. Semiconductor devices surged by over 8%, while passive components fell by 3.1%. This contrast stems from the uneven demand downstream.

The explosive growth of AI servers has become a core hotspot, with global AI server shipments increasing by 68% year-on-year, directly driving a surge in demand for high-end materials such as HVLP4-grade high-frequency and high-speed copper foil. Currently, the global monthly production capacity of such copper foil is only 700 tons, while demand has reached 850 tons, resulting in a gap of over 40%. Its price is twice that of ordinary products. Automotive-grade MCUs, MEMS sensors, and other categories are also in tight supply, with industrial-grade MCUs growing by over 50%, and leading companies maintaining gross profit margins above 40%.

At the same time, traditional sectors face inventory pressure. Procurement of electronic components for home appliances and traditional automobiles remains low, with orders for passive components down 7% year-on-year. Inventory turnover days for some mid-to-low-end chips exceed 120 days. The root cause of the supply-demand mismatch lies in the misalignment between the capacity release cycle and the timing of demand surges. High-end material capacity construction requires 12-18 months, making it difficult to alleviate the shortfall in the short term. This "two-sided market" is testing the industry's capacity regulation capabilities.