Home / Heat Sinks / HSB23-232325

HSB23-232325

CUI Devices

Product No:

HSB23-232325

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 23 X 23 X 25 MM

Quantity:

Delivery:

Payment:

In Stock : 977

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$1.3015

$1.3015
10

$1.2616

$12.616
25

$1.22512

$30.628
50

$1.15216

$57.608
100

$1.0355

$103.55
250

$1.020908

$255.227
500

$0.955282

$477.641
1000

$0.94069

$940.69

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.984" (25.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	3.80°C/W @ 200 LFM
Length	0.906" (23.00mm)
Thermal Resistance @ Natural	12.23°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.906" (23.00mm)
Power Dissipation @ Temperature Rise	6.13W @ 75°C
Diameter	-
Package Cooled	BGA