Home / Heat Sinks / HSB18-232310

HSB18-232310

CUI Devices

Product No:

HSB18-232310

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 23 X 23 X 10 MM

Quantity:

Delivery:

Payment:

In Stock : 5332

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$0.988

$0.988
10

$0.9386

$9.386
25

$0.89148

$22.287
50

$0.86792

$43.396
100

$0.856235

$85.6235
250

$0.79762

$199.405
500

$0.750709

$375.3545
1000

$0.680333

$680.333
5000

$0.656878

$3284.39

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.394" (10.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	6.80°C/W @ 200 LFM
Length	0.906" (23.00mm)
Thermal Resistance @ Natural	20.41°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.906" (23.00mm)
Power Dissipation @ Temperature Rise	3.7W @ 75°C
Diameter	-
Package Cooled	BGA