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HSS28-B20-P39

CUI Devices

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HSS28-B20-P39

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CUI Devices

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HEAT SINK, STAMPING, TO-218/TO-2

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User Guide

Shape	Square, Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.374" (9.50mm)
Series	HSS
Type	Board Level
Thermal Resistance @ Forced Air Flow	12.00°C/W @ 200 LFM
Length	0.748" (19.00mm)
Thermal Resistance @ Natural	27.66°C/W
Mfr	CUI Devices
Package	Bag
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Width	0.748" (19.00mm)
Power Dissipation @ Temperature Rise	2.71W @ 75°C
Diameter	-
Package Cooled	TO-218, TO-220

Detail Info

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