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HSS08-B18-CP

CUI Devices

Product No:

HSS08-B18-CP

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, STAMPING, TO-218, 44.

Quantity:

Delivery:

Payment:

In Stock : 988

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$1.9475

$1.9475
10

$1.89905

$18.9905
25

$1.84794

$46.1985
50

$1.74534

$87.267
100

$1.642645

$164.2645
250

$1.539988

$384.997
500

$1.488669

$744.3345
1000

$1.334664

$1334.664
5000

$1.308996

$6544.98

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Product Information

Parameter Info

User Guide

Shape	Square
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.492" (12.50mm)
Series	HSS
Type	Board Level, Vertical
Thermal Resistance @ Forced Air Flow	3.50°C/W @ 200 LFM
Length	1.750" (44.45mm)
Thermal Resistance @ Natural	7.29°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	PC Pin
Width	1.750" (44.45mm)
Power Dissipation @ Temperature Rise	10.3W @ 75°C
Diameter	-
Package Cooled	TO-218