Home / Heat Sinks / HSB01-080808

HSB01-080808

CUI Devices

Product No:

HSB01-080808

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

Quantity:

Delivery:

Payment:

In Stock : 1190

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$0.6935

$0.6935
10

$0.66405

$6.6405
25

$0.6308

$15.77
50

$0.61427

$30.7135
100

$0.60591

$60.591
250

$0.564376

$141.094
500

$0.531183

$265.5915
1000

$0.481384

$481.384
5000

$0.464778

$2323.89

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.315" (8.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	16.00°C/W @ 200 LFM
Length	0.335" (8.50mm)
Thermal Resistance @ Natural	39.10°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive (Not Included)
Width	0.335" (8.50mm)
Power Dissipation @ Temperature Rise	1.9W @ 75°C
Diameter	-
Package Cooled	BGA