Home / Heat Sinks / HSB02-101007

HSB02-101007

CUI Devices

Product No:

HSB02-101007

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 10 X 10 X 7 MM

Quantity:

Delivery:

Payment:

In Stock : 3172

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$0.6365

$0.6365
10

$0.6061

$6.061
25

$0.57608

$14.402
50

$0.56088

$28.044
100

$0.553375

$55.3375
250

$0.515432

$128.858
500

$0.485127

$242.5635
1000

$0.439641

$439.641
5000

$0.424479

$2122.395

Not the price you want? Send RFQ Now and we'll contact you ASAP.

IICSEMI, as a globally renowned distributor of electronic components,sells a wide range of electronic parts from the world's top brands, ensuring all products undergo strict quality control and meet the highest standards. If you are interested in learning about the detailed specifications,configurations, pricing, lead times, and payment terms for HSB02-101007, please feel free to contact us. To facilitate the processing of your inquiry, kindly include HSB02-101007 and the required quantity in your RFQ. IICSEMI provides the latest quote for HSB02-101007 without requiring registration. Latest information on HSB02-101007: #Specifications #FAQ #Datasheet #Labels #Related Products #Associated Blogs HSB02-101007 latest information：#Specification#FAQ#Datasheet#Tags#Recommended Parts#Related Blog

Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.275" (7.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	16.50°C/W @ 200 LFM
Length	0.394" (10.00mm)
Thermal Resistance @ Natural	37.90°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.394" (10.00mm)
Power Dissipation @ Temperature Rise	2.0W @ 75°C
Diameter	-
Package Cooled	BGA