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HSB03-121218

CUI Devices

Product No:

HSB03-121218

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, BGA, 12 X 12 X 18 MM

Quantity:

Delivery:

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Payment:

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In Stock : 2268

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $0.8645

    $0.8645

  • 10

    $0.81985

    $8.1985

  • 25

    $0.77862

    $19.4655

  • 40

    $0.757862

    $30.31448

  • 80

    $0.747774

    $59.82192

  • 230

    $0.696512

    $160.19776

  • 440

    $0.655519

    $288.42836

  • 2520

    $0.594073

    $1497.06396

  • 5040

    $0.573591

    $2890.89864

Not the price you want? Send RFQ Now and we'll contact you ASAP.

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IICSEMI, as a globally renowned distributor of electronic components,sells a wide range of electronic parts from the world's top brands, ensuring all products undergo strict quality control and meet the highest standards. If you are interested in learning about the detailed specifications,configurations, pricing, lead times, and payment terms for HSB03-121218, please feel free to contact us. To facilitate the processing of your inquiry, kindly include HSB03-121218 and the required quantity in your RFQ. IICSEMI provides the latest quote for HSB03-121218 without requiring registration. Latest information on HSB03-121218: #Specifications #FAQ #Datasheet #Labels #Related Products #Associated Blogs HSB03-121218 latest information:#Specification#FAQ#Datasheet#Tags#Recommended Parts#Related Blog

Product Information

Parameter Info

User Guide

Shape Square, Pin Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.709" (18.00mm)
Series HSB
Type Top Mount
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 200 LFM
Length 0.472" (12.00mm)
Thermal Resistance @ Natural 24.01°C/W
Mfr CUI Devices
Package Tray
Material Finish Black Anodized
Attachment Method Adhesive
Width 0.472" (12.00mm)
Power Dissipation @ Temperature Rise 3.1W @ 75°C
Diameter -
Package Cooled BGA

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