Home / Heat Sinks / HSB03-141406

HSB03-141406

CUI Devices

Product No:

HSB03-141406

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 14 X 14 X 6 MM

Quantity:

Delivery:

Payment:

In Stock : 3465

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$0.703

$0.703
10

$0.67165

$6.7165
25

$0.63802

$15.9505
50

$0.6213

$31.065
100

$0.612845

$61.2845
250

$0.570912

$142.728
500

$0.53732

$268.66
1000

$0.486951

$486.951
5000

$0.470155

$2350.775

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.236" (6.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	15.80°C/W @ 200 LFM
Length	0.551" (14.00mm)
Thermal Resistance @ Natural	35.98°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.551" (14.00mm)
Power Dissipation @ Temperature Rise	2.1W @ 75°C
Diameter	-
Package Cooled	BGA