Home / Heat Sinks / HSB04-171706

HSB04-171706

CUI Devices

Product No:

HSB04-171706

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 17 X 17 X 6 MM

Quantity:

Delivery:

Payment:

In Stock : 3251

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$0.7695

$0.7695
10

$0.7372

$7.372
25

$0.69996

$17.499
50

$0.68172

$34.086
100

$0.67241

$67.241
250

$0.626354

$156.5885
500

$0.589513

$294.7565
1000

$0.534252

$534.252
5000

$0.515831

$2579.155

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.236" (6.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	13.10°C/W @ 200 LFM
Length	0.669" (17.00mm)
Thermal Resistance @ Natural	29.73°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.669" (17.00mm)
Power Dissipation @ Temperature Rise	2.5W @ 75°C
Diameter	-
Package Cooled	BGA