Home / Heat Sinks / HSB05-171711
minImg

HSB05-171711

CUI Devices

Product No:

HSB05-171711

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

pdf.png

Description:

HEAT SINK, BGA, 17 X 17 X 11.5 M

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

In Stock : 2573

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $1.026

    $1.026

  • 10

    $0.97565

    $9.7565

  • 25

    $0.94962

    $23.7405

  • 50

    $0.92397

    $46.1985

  • 100

    $0.87267

    $87.267

  • 250

    $0.821332

    $205.333

  • 500

    $0.769994

    $384.997

  • 1000

    $0.718666

    $718.666

  • 5000

    $0.692996

    $3464.98

Not the price you want? Send RFQ Now and we'll contact you ASAP.

Certif02 Certif07 Certif03 Certif04 Certif08 Certif10 Certif09 Certif05 Certif06
IICSEMI, as a globally renowned distributor of electronic components,sells a wide range of electronic parts from the world's top brands, ensuring all products undergo strict quality control and meet the highest standards. If you are interested in learning about the detailed specifications,configurations, pricing, lead times, and payment terms for HSB05-171711, please feel free to contact us. To facilitate the processing of your inquiry, kindly include HSB05-171711 and the required quantity in your RFQ. IICSEMI provides the latest quote for HSB05-171711 without requiring registration. Latest information on HSB05-171711: #Specifications #FAQ #Datasheet #Labels #Related Products #Associated Blogs HSB05-171711 latest information:#Specification#FAQ#Datasheet#Tags#Recommended Parts#Related Blog

Product Information

Parameter Info

User Guide

Shape Square, Pin Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.453" (11.50mm)
Series HSB
Type Top Mount
Thermal Resistance @ Forced Air Flow 8.40°C/W @ 200 LFM
Length 0.669" (17.00mm)
Thermal Resistance @ Natural 23.91°C/W
Mfr CUI Devices
Package Box
Material Finish Black Anodized
Attachment Method Adhesive
Width 0.669" (17.00mm)
Power Dissipation @ Temperature Rise 3.1W @ 75°C
Diameter -
Package Cooled BGA

HSB05-171711 Tags

  • HSB05-171711
  • HSB05-171711 PDF
  • HSB05-171711 datasheet
  • HSB05-171711 specifications
  • HSB05-171711 images
  • buy HSB05-171711
  • HSB05-171711 price
  • HSB05-171711 category
  • HSB05-171711 related products
  • HSB05-171711 related news