Home / Heat Sinks / HSB06-181810

HSB06-181810

CUI Devices

Product No:

HSB06-181810

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 18 X 18 X 10 MM

Quantity:

Delivery:

Payment:

In Stock : 422

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$0.969

$0.969
10

$0.91675

$9.1675
25

$0.893

$22.325
50

$0.86868

$43.434
100

$0.820515

$82.0515
250

$0.772198

$193.0495
500

$0.723938

$361.969
1000

$0.675678

$675.678
5000

$0.651548

$3257.74

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.394" (10.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	18.80°C/W @ 200 LFM
Length	0.709" (18.00mm)
Thermal Resistance @ Natural	23.68°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.709" (18.00mm)
Power Dissipation @ Temperature Rise	3.2W @ 75°C
Diameter	-
Package Cooled	BGA