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HSB07-202009

CUI Devices

Product No:

HSB07-202009

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 20 X 20 X 9 MM

Quantity:

Delivery:

Payment:

In Stock : 1257

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$0.798

$0.798
10

$0.7619

$7.619
25

$0.7239

$18.0975
50

$0.70471

$35.2355
100

$0.69521

$69.521
250

$0.647558

$161.8895
500

$0.609482

$304.741
1000

$0.55234

$552.34
5000

$0.533292

$2666.46

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.354" (9.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	8.60°C/W @ 200 LFM
Length	0.787" (20.00mm)
Thermal Resistance @ Natural	24.08°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.787" (20.00mm)
Power Dissipation @ Temperature Rise	3.1W @ 75°C
Diameter	-
Package Cooled	BGA