Home / Heat Sinks / HSB08-212106

HSB08-212106

CUI Devices

Product No:

HSB08-212106

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 21 X 21 X 6 MM

Quantity:

Delivery:

Payment:

In Stock : 1621

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$0.8455

$0.8455
10

$0.8018

$8.018
25

$0.7619

$19.0475
50

$0.74195

$37.0975
100

$0.731975

$73.1975
250

$0.681834

$170.4585
500

$0.641706

$320.853
1000

$0.581552

$581.552
5000

$0.561498

$2807.49

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.236" (6.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	9.70°C/W @ 200 LFM
Length	0.827" (21.00mm)
Thermal Resistance @ Natural	25.40°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.827" (21.00mm)
Power Dissipation @ Temperature Rise	3.0W @ 75°C
Diameter	-
Package Cooled	BGA