Home / Heat Sinks / HSB10-232306

HSB10-232306

CUI Devices

Product No:

HSB10-232306

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 23 X 23 X 6 MM

Quantity:

Delivery:

Payment:

In Stock : 1309

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$0.798

$0.798
10

$0.7562

$7.562
25

$0.7182

$17.955
50

$0.69939

$34.9695
100

$0.68989

$68.989
250

$0.642656

$160.664
500

$0.604865

$302.4325
1000

$0.54816

$548.16
5000

$0.529264

$2646.32

Not the price you want? Send RFQ Now and we'll contact you ASAP.

IICSEMI, as a globally renowned distributor of electronic components,sells a wide range of electronic parts from the world's top brands, ensuring all products undergo strict quality control and meet the highest standards. If you are interested in learning about the detailed specifications,configurations, pricing, lead times, and payment terms for HSB10-232306, please feel free to contact us. To facilitate the processing of your inquiry, kindly include HSB10-232306 and the required quantity in your RFQ. IICSEMI provides the latest quote for HSB10-232306 without requiring registration. Latest information on HSB10-232306: #Specifications #FAQ #Datasheet #Labels #Related Products #Associated Blogs HSB10-232306 latest information：#Specification#FAQ#Datasheet#Tags#Recommended Parts#Related Blog

Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.236" (6.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	9.60°C/W @ 200 LFM
Length	0.906" (23.00mm)
Thermal Resistance @ Natural	25.46°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.906" (23.00mm)
Power Dissipation @ Temperature Rise	3.0W @ 75°C
Diameter	-
Package Cooled	BGA