Home / Heat Sinks / HSB11-252518

HSB11-252518

CUI Devices

Product No:

HSB11-252518

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 25 X 25 X 18 MM

Quantity:

Delivery:

Payment:

In Stock : 54

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$1.216

$1.216
10

$1.15235

$11.5235
25

$1.12176

$28.044
50

$1.09155

$54.5775
100

$1.030845

$103.0845
250

$0.970254

$242.5635
500

$0.909606

$454.803
1000

$0.848968

$848.968
5000

$0.818644

$4093.22

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.709" (18.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	4.50°C/W @ 200 LFM
Length	0.984" (25.00mm)
Thermal Resistance @ Natural	13.70°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.984" (25.00mm)
Power Dissipation @ Temperature Rise	5.5W @ 75°C
Diameter	-
Package Cooled	BGA