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HSB12-272706

CUI Devices

Product No:

HSB12-272706

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, BGA, 27 X 27 X 6 MM

Quantity:

Delivery:

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Payment:

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In Stock : 1171

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $0.8455

    $0.8455

  • 10

    $0.8018

    $8.018

  • 25

    $0.7619

    $19.0475

  • 50

    $0.74195

    $37.0975

  • 100

    $0.731975

    $73.1975

  • 250

    $0.681834

    $170.4585

  • 500

    $0.641706

    $320.853

  • 1000

    $0.581552

    $581.552

  • 5000

    $0.561498

    $2807.49

Not the price you want? Send RFQ Now and we'll contact you ASAP.

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IICSEMI, as a globally renowned distributor of electronic components,sells a wide range of electronic parts from the world's top brands, ensuring all products undergo strict quality control and meet the highest standards. If you are interested in learning about the detailed specifications,configurations, pricing, lead times, and payment terms for HSB12-272706, please feel free to contact us. To facilitate the processing of your inquiry, kindly include HSB12-272706 and the required quantity in your RFQ. IICSEMI provides the latest quote for HSB12-272706 without requiring registration. Latest information on HSB12-272706: #Specifications #FAQ #Datasheet #Labels #Related Products #Associated Blogs HSB12-272706 latest information:#Specification#FAQ#Datasheet#Tags#Recommended Parts#Related Blog

Product Information

Parameter Info

User Guide

Shape Square, Pin Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.236" (6.00mm)
Series HSB
Type Top Mount
Thermal Resistance @ Forced Air Flow 7.80°C/W @ 200 LFM
Length 1.063" (27.00mm)
Thermal Resistance @ Natural 19.59°C/W
Mfr CUI Devices
Package Box
Material Finish Black Anodized
Attachment Method Adhesive
Width 1.063" (27.00mm)
Power Dissipation @ Temperature Rise 3.8W @ 75°C
Diameter -
Package Cooled BGA

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