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HSB13-303014

CUI Devices

Product No:

HSB13-303014

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 30.7 X 30.7 X 14

Quantity:

Delivery:

Payment:

In Stock : 419

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$1.2825

$1.2825
10

$1.2217

$12.217
25

$1.1894

$29.735
50

$1.1571

$57.855
100

$1.09288

$109.288
250

$1.028584

$257.146
500

$0.964288

$482.144
1000

$0.900011

$900.011
5000

$0.867863

$4339.315

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.551" (14.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	4.70°C/W @ 200 LFM
Length	1.209" (30.70mm)
Thermal Resistance @ Natural	12.36°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	1.209" (30.70mm)
Power Dissipation @ Temperature Rise	6.1W @ 75°C
Diameter	-
Package Cooled	BGA