Home / Heat Sinks / HSB19-272718

HSB19-272718

CUI Devices

Product No:

HSB19-272718

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 27 X 27 X 18 MM

Quantity:

Delivery:

Payment:

In Stock : 631

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$1.8335

$1.8335
10

$1.73755

$17.3755
25

$1.69176

$42.294
50

$1.64597

$82.2985
100

$1.554485

$155.4485
250

$1.463038

$365.7595
500

$1.37161

$685.805
1000

$1.280163

$1280.163
5000

$1.234449

$6172.245

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.709" (18.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	4.50°C/W @ 200 LFM
Length	1.063" (27.00mm)
Thermal Resistance @ Natural	11.11°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	1.063" (27.00mm)
Power Dissipation @ Temperature Rise	6.8W @ 75°C
Diameter	-
Package Cooled	BGA