Home / Heat Sinks / HSB20-353525

HSB20-353525

CUI Devices

Product No:

HSB20-353525

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 35 X 35 X 25 MM

Quantity:

Delivery:

Payment:

In Stock : 478

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$1.881

$1.881
10

$1.8316

$18.316
25

$1.7822

$44.555
50

$1.6834

$84.17
100

$1.584315

$158.4315
250

$1.485306

$371.3265
500

$1.435792

$717.896
1000

$1.287269

$1287.269
5000

$1.262512

$6312.56

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.984" (25.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	2.70°C/W @ 200 LFM
Length	1.378" (35.00mm)
Thermal Resistance @ Natural	6.65°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	1.378" (35.00mm)
Power Dissipation @ Temperature Rise	11.3W @ 75°C
Diameter	-
Package Cooled	BGA