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HSB25-282810

CUI Devices

Product No:

HSB25-282810

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 28.5 X 28.5 X 10

Quantity:

Delivery:

Payment:

In Stock : 1518

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$1.235

$1.235
10

$1.1951

$11.951
25

$1.16052

$29.013
50

$1.09155

$54.5775
100

$0.98097

$98.097
250

$0.967176

$241.794
500

$0.905008

$452.504
1000

$0.891186

$891.186

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.394" (10.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	5.10°C/W @ 200 LFM
Length	1.122" (28.50mm)
Thermal Resistance @ Natural	15.41°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Push Pin
Width	1.122" (28.50mm)
Power Dissipation @ Temperature Rise	4.87W @ 75°C
Diameter	-
Package Cooled	BGA