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HSB26-343408

CUI Devices

Product No:

HSB26-343408

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 33.5 X 33.5 X 8

Quantity:

Delivery:

Payment:

In Stock : 994

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$1.083

$1.083
10

$1.04595

$10.4595
25

$1.01536

$25.384
50

$0.95513

$47.7565
100

$0.858325

$85.8325
250

$0.84626

$211.565
500

$0.791882

$395.941
1000

$0.779788

$779.788

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.315" (8.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	5.30°C/W @ 200 LFM
Length	1.319" (33.50mm)
Thermal Resistance @ Natural	15.19°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	1.319" (33.50mm)
Power Dissipation @ Temperature Rise	4.94W @ 75°C
Diameter	-
Package Cooled	BGA