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HSB27-434316

CUI Devices

Product No:

HSB27-434316

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 43.1 X 43.1 X 16

Quantity:

Delivery:

Payment:

In Stock : 996

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$2.47

$2.47
10

$2.3902

$23.902
25

$2.32104

$58.026
50

$2.1831

$109.155
100

$1.96194

$196.194
250

$1.934352

$483.588
500

$1.809997

$904.9985
1000

$1.782371

$1782.371

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.650" (16.51mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	2.80°C/W @ 200 LFM
Length	1.697" (43.10mm)
Thermal Resistance @ Natural	8.35°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	1.697" (43.10mm)
Power Dissipation @ Temperature Rise	8.98W @ 75°C
Diameter	-
Package Cooled	BGA