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HSB30-373710

CUI Devices

Product No:

HSB30-373710

Manufacturer:

CUI Devices

Package:

Batch:

Datasheet:

Description:

HEAT SINK, BGA, 37.4 X 37 X 10 M

Quantity:

Delivery:

Payment:

In Stock : 545

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$2.128

$2.128
10

$2.05865

$20.5865
25

$1.9988

$49.97
50

$1.87986

$93.993
100

$1.68948

$168.948
250

$1.665692

$416.423
500

$1.558608

$779.304
1000

$1.53482

$1534.82

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Product Information

Parameter Info

User Guide

Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.394" (10.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	4°C/W @ 200 LFM
Length	1.472" (37.39mm)
Thermal Resistance @ Natural	11.63°C/W
Mfr	CUI Devices
Package	Box
Material Finish	Black Anodized
Attachment Method	Push Pin
Width	1.472" (37.39mm)
Power Dissipation @ Temperature Rise	6.45W @ 75°C
Diameter	-
Package Cooled	BGA