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HSE01-193175

CUI Devices

Product No:

HSE01-193175

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, EXTRUSION, 19 X 31.5

Quantity:

Delivery:

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Payment:

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In Stock : 1542

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $1.254

    $1.254

  • 10

    $1.2122

    $12.122

  • 25

    $1.17686

    $29.4215

  • 50

    $1.10675

    $55.3375

  • 100

    $0.99465

    $99.465

  • 250

    $0.980628

    $245.157

  • 500

    $0.917567

    $458.7835

  • 1000

    $0.903564

    $903.564

Not the price you want? Send RFQ Now and we'll contact you ASAP.

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IICSEMI, as a globally renowned distributor of electronic components,sells a wide range of electronic parts from the world's top brands, ensuring all products undergo strict quality control and meet the highest standards. If you are interested in learning about the detailed specifications,configurations, pricing, lead times, and payment terms for HSE01-193175, please feel free to contact us. To facilitate the processing of your inquiry, kindly include HSE01-193175 and the required quantity in your RFQ. IICSEMI provides the latest quote for HSE01-193175 without requiring registration. Latest information on HSE01-193175: #Specifications #FAQ #Datasheet #Labels #Related Products #Associated Blogs HSE01-193175 latest information:#Specification#FAQ#Datasheet#Tags#Recommended Parts#Related Blog

Product Information

Parameter Info

User Guide

Shape Square, Angled Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.295" (7.50mm)
Series HSE
Type Top Mount
Thermal Resistance @ Forced Air Flow 9.20°C/W @ 200 LFM
Length 0.748" (19.00mm)
Thermal Resistance @ Natural 25.44°C/W
Mfr CUI Devices
Package Box
Material Finish Blue Anodized
Attachment Method Thermal Tape, Adhesive (Not Included)
Width 0.748" (19.00mm)
Power Dissipation @ Temperature Rise 2.95W @ 75°C
Diameter -
Package Cooled -

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