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HSE11-B20-NP

CUI Devices

Product No:

HSE11-B20-NP

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, EXTRUSION, TO-218/TO-

Quantity:

Delivery:

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Product Information

Parameter Info

User Guide

Shape Rectangular
Material Aluminum Alloy
Product Status Active
Fin Height 0.177" (4.50mm)
Series HSE
Type Top Mount
Thermal Resistance @ Forced Air Flow 21.40°C/W @ 200 LFM
Length 0.984" (25.00mm)
Thermal Resistance @ Natural 38.90°C/W
Mfr CUI Devices
Package Bag
Material Finish Black Anodized
Attachment Method Bolt On
Width 0.472" (12.00mm)
Power Dissipation @ Temperature Rise 1.93W @ 75°C
Diameter -
Package Cooled TO-218, TO-220

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