CUI Devices
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Shape | Rectangular, Fins |
Material | Aluminum |
Product Status | Active |
Fin Height | 0.500" (12.70mm) |
Series | HSS |
Type | Board Level |
Thermal Resistance @ Forced Air Flow | 5.01°C/W @ 200 LFM |
Length | 1.500" (38.10mm) |
Thermal Resistance @ Natural | 18.63°C/W |
Mfr | CUI Devices |
Package | Box |
Material Finish | Black Anodized |
Attachment Method | PC Pin |
Width | 0.504" (12.80mm) |
Power Dissipation @ Temperature Rise | 4.0W @ 75°C |
Diameter | - |
Base Product Number | HSS-B20 |
Package Cooled | TO-220 |